Reliability of power electronic converter systems / edited by Henry Shu-hung Chung [and three others].

Format:

Book

Contributor:

Chung, Henry Shu-hung, editor.

Series:

IET power and energy series ; 80.

IET Power and Energy Series ; 80

Language:

English

Subjects (All):

Electric current converters.

Physical Description:

1 online resource (502 p.)

Place of Publication:

London, England : The Institution of Engineering and Technology, 2016.

System Details:

Mode of access: World Wide Web.

Summary:

The main aims of power electronic converter systems (PECs) are to control, convert, and condition electrical power flow, from one form to another, through the use of solid-state electronics. This book outlines R&D into the scientific modelling, experimentation and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECs at different levels of complexity. Drawing on the experience of an international team of experts, this book covers an introduction to reliability engineering and the reliability of PECs; lifetime prognosis; and robustness validation. It also covers applications including low- and high-power motor drives, wind turbine systems, photovoltaic systems, uninterruptible power supply systems, energy harvesting, power supplies for computers, high-power converters, and automotive applications. Reliability of Power Electronic Converter Systems will be of particular interest to professionals in power electronics, and the application sectors, and practicing engineers specializing in the development and application to power electronic converters and systems.

Contents:

Contents; 1. Reliability engineering in power electronic converter systems; 1.1 Performance factors of power electronic systems; 1.2 Reliability engineering in power electronics; 1.3 Challenges and opportunities in research on power electronics reliability; References; 2. Anomaly detection and remaining life prediction for power electronics; 2.1 Introduction; 2.2 Failure models; 2.3 FMMEA to identify failure mechanisms; 2.4 Data-driven methods for life prediction; 2.5 Summary; Acknowledgements; References; 3. Reliability of DC-link capacitors in power electronic converters

3.1 Capacitors for DC-links in power electronic converters3.2 Failure mechanisms and lifetime models of capacitors; 3.3 Reliability-oriented design for DC links; 3.4 Condition monitoring of DC-link capacitors; References; 4. Reliability of power electronic packaging; 4.1 Introduction; 4.2 Reliability concepts for power electronic packaging; 4.3 Reliability testing for power electronic packaging; 4.4 Power semiconductor package or module reliability; 4.5 Reliability of high-temperature power electronic modules; 4.6 Summary; Acknowledgements; References

5. Modelling for the lifetime prediction of power semiconductor modules5.1 Accelerated cycling tests; 5.2 Dominant failure mechanisms; 5.3 Lifetime modelling; 5.4 Physics-based lifetime estimation of solder joints within power semiconductor modules; 5.5 Example of physics-based lifetime modelling for solder joints; 5.6 Conclusions; Acknowledgements; References; 6. Minimization of DC-link capacitance in power electronic converter systems; 6.1 Introduction; 6.2 Performance tradeoff; 6.3 Passive approach; 6.4 Active approach; 6.5 Conclusions; Acknowledgement; References; 7. Wind turbine systems

7.1 Introduction7.2 Review of main WT power electronic architectures; 7.3 Public domain knowledge of power electronic converterreliabilities; 7.4 Reliability FMEA for each assembly and comparative prospective reliabilities; 7.5 Root causes of failure; 7.6 Methods to improve WT converter reliability and availability; 7.7 Conclusions; 7.8 Recommendations; Acknowledgements; Terminology; Abbreviations; Variables; References; 8. Active thermal control for improved reliability of power electronics systems; 8.1 Introduction; 8.2 Modulation strategies achieving better thermal loading

8.3 Reactive power control achieving better thermal cycling8.4 Thermal control strategies utilizing active power; 8.5 Conclusions; Acknowledgements; References; 9. Lifetime modeling and prediction of power devices; 9.1 Introduction; 9.2 Failure mechanisms of power modules; 9.3 Lifetime metrology; 9.4 Lifetime modeling and design of components; 9.5 Summary and conclusions; Acknowledgements; References; 10. Power module lifetime test and state monitoring; 10.1 Overview of power cycling methods; 10.2 AC current PC; 10.3 Wear-out status of PMs; 10.4 Voltage evolution in IGBT and diode

10.5 Chip temperature estimation

Notes:

Description based upon print version of record.

Includes bibliographical references at the end of each chapters and index.

Description based on online resource; title from PDF title page (ebrary, viewed January 25, 2016).

ISBN:

1-5231-0103-2

1-84919-902-7