My Account Log in

2 options

Lithography process control / Harry J. Levinson.

Knovel Electronics & Semiconductors Academic Available online

View online

Knovel Optics and Photonics Academic Available online

View online
Format:
Book
Author/Creator:
Levinson, Harry J.
Contributor:
Society of Photo-Optical Instrumentation Engineers.
Series:
Tutorial texts in optical engineering ; v. TT 28.
Tutorial texts in optical engineering ; v. TT 28
Language:
English
Subjects (All):
Semiconductors--Etching.
Semiconductors.
Microlithography--Quality control.
Microlithography.
Physical Description:
1 online resource (198 p.)
Place of Publication:
Bellingham, Wash. : SPIE Optical Engineering Press, c1999.
Language Note:
English
Summary:
This text covers lithography process control at several levels, from fundamental through advanced topics. The book is a self-contained tutorial that works both as an introduction to the technology and as a reference for the experienced lithographer. It reviews the foundations of statistical process control as background for advanced topics such as complex processes and feedback. In addition, it presents control methodologies that may be applied to process development pilot lines.
Contents:
1. Introduction to the use of statistical process control in lithography
The assumptions underlying statistical process control
The properties of statistical process control
Situations in lithography where statistical process control cannot be applied naively
Non-normal distributions
Process capability
2. Sampling
Choosing the proper sample size
Measurement location considerations
Correlations
Measurement frequency
Systematic sources of variation
3. Simple and complex processes
Definitions
Why test wafers are useful
How to address complex processes in lithography
Distinguishing between layer-specific and equipment-specific effects
4. Linewidth control
Cause and effect
Independent variables
Exposure dose
Resist thickness
Focus
Bake temperatures
Resist development
Humidity
DUV resists
special considerations
Contributions from reticles
Maximizing the process window
5. Overlay
Overlay models
Matching
Contributions from processing and alignment mark optimization
Addressing the problem of non-normal distributions
Outliers
6. Yield
Yield monitor strategy
Yield models
Parameters which affect yield
7. Process drift and automatic process control
Adjusting for process drift
The exponentially-weighted moving average
Automatic process control
8. Metrology
The need for understanding the measurement process: defect detection
Linewidth measurement using scanning electron microscopes
Electrical linewidth measurement
Measurement error budgets
Measurement of overlay
9. Control of operations
Self-control
Documentation
ISO 9000.
Notes:
Description based upon print version of record.
Includes bibliographical references and index.
ISBN:
1-61583-736-1
0-8194-7855-5
OCLC:
435970881

The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.

Find

Home Release notes

My Account

Shelf Request an item Bookmarks Fines and fees Settings

Guides

Using the Find catalog Using Articles+ Using your account