Introduction to semiconductor manufacturing technology / Hong Xiao.

Format:

Book

Author/Creator:

Xiao, Hong, author.

Contributor:

Society of Photo-Optical Instrumentation Engineers.

Series:

SPIE Press monograph ; PM220.

SPIE Press monograph ; PM220

Language:

English

Subjects (All):

Semiconductors--Design and construction.

Semiconductors.

Semiconductor industry.

Physical Description:

1 online resource (704 pages)

Edition:

Second edition

Place of Publication:

Bellingham, Wash. : SPIE, [2012]

Language Note:

English

Summary:

Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technolgies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations.

Contents:

Preface to the first edition

Preface to the second edition

Chapter 1. Introduction

Chapter 2. Introduction to integrated circuit fabrication

Chapter 3. Semiconductor basics

Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering

Chapter 5. Thermal processes

Chapter 6. Photolithography

Chapter 7. Plasma basics

Chapter 8. Ion implantation

Chapter 9. Etch

Chapter 10. Chemical vapor deposition and dielectric thin films

Chapter 11. Metallization

Chapter 12. Chemical mechanical polishing

Chapter 13. Process integration

Chapter 14. Integrated circuit processing technologies

Chapter 15. Future trends and summary.

Notes:

Description based upon print version of record.

Includes bibliographical references.

Title from PDF title page (SPIE eBooks Website, viewed 2012-07-19).

ISBN:

9780819490933

1-62870-104-8

0-8194-9093-8

OCLC:

854970277