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Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization
- Format:
- Book
- Conference/Event
- Author/Creator:
- International Workshop on Stress-Induced Phenomena in Metallization, Corporate Author.
- Conference Name:
- International Workshop on Stress-Induced Phenomena in Metallization (10th : 2008 : Austin, Texas)
- Series:
- AIP conference proceedings Stress-induced phenomena in metallization
- Language:
- English
- Subjects (All):
- Interconnects (Integrated circuit technology)--Defects--Congresses.
- Interconnects (Integrated circuit technology).
- Metal-metal bonds--Electric properties--Congresses.
- Metal-metal bonds.
- Strength of materials--Congresses.
- Strength of materials.
- Nanostructured materials--Congresses.
- Nanostructured materials.
- Semiconductors--Congresses.
- Semiconductors.
- Copper--Congresses.
- Copper.
- Other Title:
- Tenth International Workshop on Stress-Induced Phenomena in Metallization
- Place of Publication:
- [Place of publication not identified] American Institute of Physics 2009
- Language Note:
- English
- Contents:
- Electromigration in copper interconnects
- Low-K dielectrics and barrier layers
- Microstructure and stress behavior of Cu structures
- Chip package interaction, nanostructures and 3D interconnects.
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 0-7354-0680-4
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