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Stress-induced phenomena in metallization : eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010

AIP Conference Proceedings (American Institute of Physics) Available online

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Format:
Book
Conference/Event
Author/Creator:
International Workshop on Stress-Induced Phenomena in Metallization, Corporate Author.
Contributor:
Ho, P. S, Contributor.
Ogawa, Shin®ichi., Contributor.
Zschech, Ehrenfried, Contributor.
Conference Name:
International Workshop on Stress-Induced Phenomena in Metallization (11th : 2010 : Bad Schandau, Germany)
Series:
AIP conference proceedings Stress-induced phenomena in metallization
Language:
English
Subjects (All):
Interconnects (Integrated circuit technology)--Defects--Congresses.
Interconnects (Integrated circuit technology).
Metal-metal bonds--Electric properties--Congresses.
Metal-metal bonds.
Strength of materials--Congresses.
Strength of materials.
Nanostructured materials--Congresses.
Nanostructured materials.
Semiconductors--Congresses.
Semiconductors.
Copper--Congresses.
Copper.
Other Title:
International Workshop on Stress-Induced Phenomena in Metallization
Place of Publication:
[Place of publication not identified] American Institute of Physics 2010
Language Note:
English
Notes:
Bibliographic Level Mode of Issuance: Monograph
ISBN:
0-7354-0855-6

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