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Stress-induced phenomena in metallization : Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004
- Format:
- Book
- Conference/Event
- Author/Creator:
- International Workshop on Stress-Induced Phenomena in Metallization, Corporate Author.
- Conference Name:
- International Workshop on Stress-Induced Phenomena in Metallization (7th : 2004 : Austin, Tex.)
- International Workshop on Stress-Induced Phenomena in Metallization
- Series:
- AIP conference proceedings Stress-induced phenomena in metallization
- Language:
- English
- Subjects (All):
- Semiconductors--Defects--Congresses.
- Semiconductors.
- Damascening--Congresses.
- Damascening.
- Integrated circuits--Defects--Congresses.
- Integrated circuits.
- Interconnects (Integrated circuit technology)--Defects--Congresses.
- Interconnects (Integrated circuit technology).
- Dielectric films--Defects--Congresses.
- Dielectric films.
- Metallic films--Defects--Congresses.
- Metallic films.
- Thin film devices--Defects--Congresses.
- Thin film devices.
- Copper--Electric properties--Congresses.
- Copper.
- Metallizing--Congresses.
- Metallizing.
- Electrodiffusion--Congresses.
- Electrodiffusion.
- Other Title:
- Stress induced phenomena in metallization
- Place of Publication:
- [Place of publication not identified] American Institute of Physics 2004
- Language Note:
- English
- Contents:
- Fracture and reliability for low k dielectrics
- Electromigration
- Thermal stresses and void formation.
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 0-7354-0225-6
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