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Stress-induced phenomena in metallization : Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007
- Format:
- Book
- Conference/Event
- Author/Creator:
- International Workshop on Stress-Induced Phenomena in Metallization, Corporate Author.
- Conference Name:
- International Workshop on Stress-Induced Phenomena in Metallization (9th : 2007 : Kyoto, Japan)
- Series:
- AIP conference proceedings Stress-induced phenomena in metallization
- Language:
- English
- Subjects (All):
- Interconnects (Integrated circuit technology)--Defects--Congresses.
- Interconnects (Integrated circuit technology).
- Metal-metal bonds--Electric properties--Congresses.
- Metal-metal bonds.
- Strength of materials--Congresses.
- Strength of materials.
- Nanostructured materials--Congresses.
- Nanostructured materials.
- Semiconductors--Congresses.
- Semiconductors.
- Copper--Congresses.
- Copper.
- Other Title:
- Ninth International Workshop on Stress-Induced Phenomena in Metallization
- Place of Publication:
- [Place of publication not identified] American Institute of Physics 2007
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 0-7354-0459-3
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