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Advances in Cryogenic Engineering: Vol. 52: Transactions of the International Cryogenic Materials Conference - Icmc

AIP Conference Proceedings (American Institute of Physics) Available online

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Format:
Book
Author/Creator:
Balachandran, U. Balu, Author.
Series:
AIP conference proceedings ; Volume 824.
AIP conference proceedings ; Volume 824
Language:
English
Subjects (All):
Low temperature engineering--Congresses.
Low temperature engineering.
Physical Description:
1 online resource (viii, 376 pages).
Other Title:
Advances In Cryogenic Engineering, Volume 824
Place of Publication:
[Place of publication not identified] American Institute of Physics 2006
Language Note:
English
Summary:
The 2005 joint Cryogenic Engineering Conference and International Cryogenic Materials Conference (CEC-ICMC) was held in Colorado, from August 29th to September 2nd, 2005. Papers in the ICMC part of the conference present the information on materials and their properties used in cryogenic temperatures.
Contents:
Mechanical properties of structural materials
Resins, polymers and composite materials at low-temperatures
LTS, HTS, and novel superconductors
New materials
Papers presented at the International Workshop on Cryogenic Structural Materials and Their Evaluation Methods (Fairbanks, Alaska, June 15-16, 2013).
Notes:
Bibliographic Level Mode of Issuance: Monograph
ISBN:
0-7354-0316-3

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