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Electromagnetic nondestructive evaluation (XIII) [electronic resource] / edited by Jeremy Knopp ... [et al.].

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Format:
Book
Conference/Event
Author/Creator:
International Workshop on Electromagnetic Nondestructive Evaluation, Corporate Author.
Contributor:
Knopp, Jeremy.
Conference Name:
International Workshop on Electromagnetic Nondestructive Evaluation (14th : 2009 : Dayton, Ohio)
Series:
Studies in applied electromagnetics and mechanics ; 33.
Studies in applied electromagnetics and mechanics, 1383-7281 ; v. 33
Language:
English
Subjects (All):
Magnetic testing--Congresses.
Magnetic testing.
Electromagnetic measurements--Congresses.
Electromagnetic measurements.
Physical Description:
1 online resource (316 p.)
Place of Publication:
Amsterdam : IOS Press, 2010.
Language Note:
English
Summary:
The 14th International Workshop on Electromagnetic Nondestructive Evaluation (ENDE) was held at the Crowne Plaza Hotel in Dayton, Ohio, USA in July 2009, where the ENDE activities in the Dayton area reflect the local aerospace industry. With 80 participants from over ten countries worldwide, this workshop provided an important opportunity for an international exchange of information and ideas. This book contains the proceedings of that workshop. From the 59 oral and poster presentations, 39 were submitted for publication. Of these, 37 peer-reviewed papers appear in this volume. These papers pr
Contents:
Title page; Preface; Workshop Committees; List of Participants; Contents; Advanced Modeling of Eddy Current NDE; Microwave & TeraHertz Techniques; Metallic Materials Characterization and Residual Stress; EMATs and Nuclear; Aging Aircraft I; Aging Aircraft II; Model Based Inversion and Imaging; Poster Session; Subject Index; Author Index
Notes:
"The 14th International Workshop on Electromagnetic Nondestructive Evaluation (ENDE) was held at the Crowne Plaza Hotel in Dayton, Ohio, USA from 21 July through 23 July 2009."--P. v.
Includes bibliographical references and indexes.
ISBN:
6612692863
1-282-69286-0
9786612692864
1-60750-554-1
OCLC:
647216362

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