Handbook of silicon based MEMS materials and technologies / Veikko Lindroos ... [et al.].

Format:

Book

Contributor:

Lindroos, Veikko.

Series:

Micro & nano technologies.

Micro & nano technologies

Language:

English

Subjects (All):

Microelectromechanical systems.

Microelectromechanical systems--Materials.

Silicon--Electric properties.

Silicon.

Physical Description:

1 online resource (669 p.)

Edition:

1st ed.

Place of Publication:

Amsterdam ; Boston : William Andrew/Elsevier, 2010.

Language Note:

English

System Details:

text file

Summary:

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS materialMaterial properties and measurement techniquesAnalytical methods used in materials characterizationModeling in MEMSMeasuring MEMSMicromachining technologies in MEMSEncapsulation of MEMS componentsEmerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well

Contents:

Front Cover

Handbook of Silicon Based MEMS Materials and Technologies

Copyright Page

Contents

Preface

List of Contributors

Overview

Impact of Silicon MEMS-30 years after

Introduction

Towards Mass Volumes of MEMS Devices

Ink Jet Printer Nozzles Create the Industry

Automotive Applications Drive the Reliability and the Quality

Leaps Towards a Generic Manufacturing Platform

Towards Every Pocket

Mobile Phones and Mobile Multimedia Computers

Ubiquitous Sensing, Computing and Communication

Future of MEMS Technologies

Conclusions

Acknowledgements

References

PART I: Silicon as MEMS Material

Chapter 1 Properties of Silicon

1.1 Properties of Silicon

Chapter 2 Czochralski Growth of Silicon Crystals

2.1 The CZ Crystal-Growing Furnace

2.2 Stages of Growth Process

2.3 Issues of Crystal Growth

2.4 Improved Thermal and Gas Flow Designs

2.5 Heat Transfer

2.6 Melt Convection

2.7 Magnetic Fields

2.8 Hot Recharging

Further reading

Chapter 3 Properties of Silicon Crystals

3.1 Dopants and Impurities

3.2 Typical Impurity Concentrations

3.3 Concentration of Dopants and Impurities in Axial Direction

3.4 Resistivity

3.5 Radial Variation of Impurities and Resistivity

3.6 Thermal Donors

3.7 Defects in Silicon Crystals

3.8 Control of Vacancies, Interstitials, and the OISF Ring

3.9 Conclusion

Acknowledgments

Chapter 4 Oxygen in Silicon

4.1 Oxygen in Solid Solution

4.2 Formation of Small Oxygen Aggregates

4.3 Precipitation of Oxygen

4.4 Precipitate-Induced Defects

4.5 Behavior of Oxygen in Basic Heat Treatment Procedures

Chapter 5 Silicon Wafers: Preparation and Properties

5.1 Silicon Wafer Manufacturing Process

5.2 Standard Measurements of Polished Wafers.

5.3 Sample Specifications of MEMS Wafers

5.4 Standards of Silicon Wafers

Chapter 6 Epi Wafers: Preparation and Properties

6.1 Silicon Epitaxy-The Basics

6.2 The Epi-Poly Process

6.3 Etch Stop Layers

6.4 Epi on SOI Substrates

6.5 Selective Epitaxy and Epitaxial Layer Overgrowth

6.6 Metrology

6.7 Commercially Available Epitaxy Systems

6.8 Summary

Chapter 7 Thick-Film SOI Wafers: Preparation and Properties

7.1 Introduction

7.2 Overview of SOI

7.3 Silicon Wafer Parameters for Direct Bonding

7.4 Fabrication of Thick-Film BSOI by Mechanical Grinding and Polishing

7.5 BESOI Process

7.6 Techniques Based on Thin-Film SOI and Silicon Epitaxy

7.7 Conclusion

Chapter 8 Silicon Dioxides

8.1 Introduction

8.2 Growth Methods of Silicon Dioxide

8.3 Structure and Properties of Silicon Dioxides

8.4 Processing of Silicon Dioxides

PART II: Modeling in MEMS Methods

Chapter 9 Multiscale Modeling

9.1 Microscopic and Macroscopic Equations

9.2 Computational Methods

Chapter 10 Manufacture and Processing of MEMS Structures

10.1 Introduction

10.2 Requirements for Modeling Micromachining

10.3 Micromachining As a Front Propagation Problem

10.4 Anisotropic Etching: Geometrical Simulators

10.5 Anisotropic Etching: Atomistic Simulators

10.6 A Survey of Etching Simulators

Chapter 11 Mechanical Properties of Silicon Microstructures

11.1 Basic Structural Properties of Crystalline Silicon

11.2 Dislocations in Silicon

11.3 Physical Mechanisms of Fracture in Silicon

11.4 Physical Mechanisms of Fatigue of Silicon

Additional References

Chapter 12 Electrostatic and RF-Properties of MEMS Structures

12.1 Introduction

12.2 Model System for a Dynamic Micromechanical Device.

12.3 Electrical Equivalent Circuit

12.4 Electrostatic Force

12.5 Electromechanical Coupling

12.6 Sensing of Motion

12.7 Pull-in Phenomenon

12.8 Parasitic Capacitance

12.9 Effect of Built-in Potential on Capacitively Coupled MEMS-Devices

12.10 Further Effects of Electrostatic Nonlinearities from Applications Point of View

12.11 RF-Properties

Chapter 13 Optical Modeling of MEMS

13.1 Optical Properties of Silicon and Related Materials

13.2. Theoretical Background

13.3 Numerical Modeling Methods for Optical MEMS

Chapter 14 Gas Damping in Vibrating MEMS Structures

14.1 Introduction

14.2 Damping Dominated by Gas Viscosity

14.3 First-Order Frequency Dependencies

14.4 Viscoacoustic Models

14.5 Simulation Tools

PART III: Measuring MEMS

Chapter 15 Introduction to Measuring MEMS

15.1 On MEMS Measurements

15.2 Variation and Mapping

15.3 MEMS Measurement Challenges

Chapter 16 Silicon Wafer and Thin Film Measurements

16.1 Important Measurements

16.2 Wafer Shape

16.3 Resistivity

16.4 Thickness of Thin Films

Chapter 17 Optical Measurement of Static and Dynamic Displacement in MEMS

17.1 Camera-Based Measurements

Chapter 18 MEMS Residual Stress Characterization: Methodology and Perspective

18.1 Introduction

18.2 MEMS residual stress characterization techniques

18.3 Perspective and Conclusion

Chapter 19 Strength of Bonded Interfaces

19.1 Solid Mechanics

19.2 Double Cantilever Beam Test Method

19.3 Tensile Test Method

19.4 Blister Test Method

19.5 Chevron Test Structures

19.6 Summary and Outlook

Chapter 20 Focused Ion and Electron Beam Techniques

20.1 Brief Introduction to DualBeam Instrumentation.

20.2 FIB for Direct Milling and Deposition of Structures

20.3 SEM for Direct Deposition or Lithography of Structures

20.4 DualBeam Applications of FA and Characterization of MEMS Devices

Reference

Chapter 21 Oxygen and Bulk Microdefects in Silicon

21.1 Measuring Oxygen in Silicon

21.2 Measuring Bulk Microdefects

PART IV: Micromachining Technologies in MEMS

Chapter 22 MEMS Lithography

22.1 Lithography Considerations Before Wafer Processing

22.2 Wafers in Lithography Process

22.3 Processing After Lithography

22.4 Thick Photoresist Lithography

Chapter 23 Deep Reactive Ion Etching

23.1 Etch Chemistries

23.2 Equipment

23.3 DRIE Processes

23.4 DRIE Advanced Issues and Challenges

23.5 DRIE Applications

23.6 Post-DRIE Etch Treatments

23.7 Choosing between Wet and Dry Etching

Chapter 24 Wet Etching of Silicon

24.1 Basic Description of Anisotropic Etching: Faceting

24.2 Beyond Faceting: Atomistic Phenomena

24.3 Beyond Atomistics: Electrochemistry

24.4 Typical Surface Morphologies (I. Zubel and M.A. Gosálvez)

24.5 Effects from Silicon Wafer Features (E. Viinikka)

24.6 Convex Corner Undercutting

24.7 Examples of Wet Etching

24.8 Popular Wet Etchants

24.9 Temperature Dependence of the Etch Rate

24.10. Concentration Dependence of the Etch Rate

24.11 Other Variables Affecting the Etch-Rate Values

24.12 Experimental Determination of Etch Rates

24.13 Converting Between Different Measures of Concentration

Chapter 25 Porous Silicon Based MEMS

25.1 Porous Silicon Background

25.2 PS Sacrificial Layer Technologies

25.3 PS Fabrication Technology

25.4 Microscopic Processes Underlying PS Formation

25.5 Formation of Silicon Microstructures

25.6 Application Examples

25.7 Summary and Conclusions.

References

Chapter 26 Atomic Layer Deposition in MEMS Technology

26.1 Atomic Layer Deposition: An Introduction

26.2 Operation Principles of ALD

26.3 ALD Processes

26.4 Characteristics of ALD Processes and Films

26.5 ALD Reactors

26.6 Applications for ALD in MEMS

26.7 Outlook

Chapter 27 Metallic Glass

27.1 Introduction

27.2 Glassy/Amorphous Metals

27.3 Properties of Metallic Glasses

27.4 Microfabrication Ability of BMGs

27.5 Nanoforming Ability of Glassy Metals (Below 100 nm)

27.6 Applications of BMGs in MEMS

27.7 Metallic Glass Thin Films: A Pathway to Integrated MEMS

27.8 Micro/Nanofabrication Ability of Glassy Thin Films

Chapter 28 Surface Micromachining

28.1 Polycrystalline Silicon-Based Micromachining

28.2 Integration Concepts

28.3 Metallic MEMS

28.4 SOI-Wafer-Based Surface Micromachining

Chapter 29 Silicon Based BioMEMS: Micromachining Technologies

29.1 Introduction to Silicon Based BioMEMS Devices

29.2 Silicon BioMEMS for Health Care

29.3 Silicon BioMEMS for Biological Detection

29.4 Conclusions and Future Research Areas

PART V: Encapsulation of MEMS Components

Chapter 30 Introduction to Encapsulation of MEMS

30.1 Early Work on Bulk-MEMS Devices

30.2 Encapsulation in Surface Micromachining

30.3 Protection of the MEMS Device

30.4 Controlled Atmosphere

30.5 Structural Functions

30.6 Wafer Bonding Methods

30.7 Sealing by Film Deposition

30.8 Via Technologies

Chapter 31 Silicon Direct Bonding

31.1 Hydrophilic High-Temperature Wafer Bonding

31.2 Hydrophobic High-Temperature Bonding of Silicon

31.3 Low-Temperature Direct Bonding of Silicon

31.4 Direct Bonding of CVD Oxides

31.5 Direct Bonding of CVD Silicon

Chapter 32 Anodic Bonding.

32.1 Introduction.

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

9786612541148

9780815519881

0815519885

9780080947723

0080947727

9781282541146

1282541145

OCLC:

667288128