Electromigration in ULSI interconnections / Cher Ming Tan.

Format:

Book

Author/Creator:

Tan, Cher Ming, 1959-

Series:

International series on advances in solid state electronics and technology.

International series on advances in solid state electronics and technology (ASSET)

Language:

English

Subjects (All):

Integrated circuits--Ultra large scale integration.

Integrated circuits.

Electrodiffusion.

Physical Description:

1 online resource (312 p.)

Edition:

1st ed.

Place of Publication:

Hackensack, N.J. : World Scientific, c2010.

Language Note:

English

Summary:

""Electromigration in ULSI Interconnections"" provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experim

Contents:

Preface; Contents; 1. Introduction; 2. History of Electromigration; 3. Experimental Studies of Al Interconnections; 4. Experimental Studies of Cu Interconnections; 5. Numerical Modeling of Electromigration; 6. Future Challenges; Index; Biography

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

9786613143716

9781283143714

1283143712

9789814273336

9814273333

OCLC:

714877548