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ISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis : November 1-5 2015, Oregon Convention Center, Portland, Oregon, USA / organized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Symposium for Testing and Failure Analysis (41st : 2015 : Portland, Oregon), organizer.
- Language:
- English
- Subjects (All):
- Electronics--Materials--Testing--Congresses.
- Electronics.
- Materials--Testing--Congresses.
- Materials.
- Electronic apparatus and appliances--Testing--Congresses.
- Electronic apparatus and appliances.
- Semiconductors--Testing--Congresses.
- Semiconductors.
- Physical Description:
- 1 online resource (536 pages) : illustrations (some color)
- Edition:
- 1st ed.
- Place of Publication:
- Materials Park, Ohio : ASM International, [2015]
- Language Note:
- English
- Summary:
- This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Follow the Data!
- Contents:
- Intro
- 01_41044
- 02_40930
- 03_40994
- 04_41061_resized
- 05_40880
- 06_40908
- Combinational Logic Analysis using Laser Voltage Probing
- Venkat Krishnan Ravikumar, Winson Lua, Seah Yi Xuan, Gopinath Ranganathan, Angeline Phoa
- Device Analysis Laboratory, Advanced Micro Devices, Singapore
- Venkat-krishnan.ravikumar@amd.com
- Abstract
- 1. Introduction
- 3. Combinational Logic Analysis Procedure
- Case Studies
- Conclusions
- Acknowledgments
- Authors would like to thank AMD management and Rod Wampler from AMD Austin who advised this work
- References
- 07_41012
- 08_40706
- 09_41013
- 10_40981
- 11_40980
- 12_41004
- 13_40973
- 14_41006
- 15_41017
- 16_40893
- 17_40860
- 18_40802
- 19_40897
- 20_40943
- 21_41078
- 22_41066_resized
- 23_40938
- 24_40936
- 25_40972
- 26_40944
- 28_40985
- 29_41077
- Update on Draft SAE AS6171 Standard - Tools and Techniques for Detection and Mitigation of Counterfeit Electronics
- William E. Vanderlinde
- Bhanu P. Sood
- 30_40989
- 31_41008
- 32_40991
- 33_40993
- 34_40932
- 35_40921
- 36_40801
- 37_40766
- 38_41042_resized
- 39_41032_resized
- 40_40907_resized
- 41_40954
- I. Introduction
- II. Processes of Failure Analysis
- (1) Electronic-optical parameter test
- (2) Internal visual and mechanical inspection
- III. Some Mechanism Explanations
- IV. Conclusion
- 42_40986_revised
- 43_40891
- 44_40889
- 45_40965
- 46_40963
- 47_40959_resized
- 48_40968
- 49_40974
- 50_40678
- 51_41023
- 52_40919
- 53_40898
- 54_40778
- Hua Younan, Chen Yixin, Fu Chao and Li Xiaomin
- Email:Younan@wintech-nano.com
- Introduction
- Galvanic Corrosion
- 55_41024
- 56_40892_resized
- 57_41034
- 59_40854
- 60_40794
- 61_40956.
- A More Rapid Approach in Revealing the Physical Status of Polyfuses and Thin Film Fuses in a Multi-Layer Integrated Circuit
- Jason H. Lagar
- Analog Devices Gen. Trias, Inc., Philippines
- jason.lagar@analog.com
- Rudolf A. Sia
- rudolf.sia@analog.com
- Melanie S. Cajita
- melanie.cajita@analog.com
- ABSTRACT
- INTRODUCTION
- EXPERIMENTAL METHODOLOGY
- RESULTS AND DISCUSSION
- CONCLUSIONS
- ACKNOWLEDGEMENTS
- REFERENCES
- 62_40929
- 63_41046
- 64_40902
- 65_40926
- 66_40904
- 67_40961
- 68_40909_reformatted
- 69_41005_resized
- 70_40987
- 71_41038
- 72_40958
- 73_41009
- 74_41010
- 75_40915
- 76_40855_resized
- 77_41020
- 78_41018
- 79_41139_renumbered
- 80_41016
- 81_40890
- 82_40829
- Peter Jacob
- EMPA Swiss Fed Labs for Materials Testing and Research, CH-8600 Duebendorf, Switzerland
- Peter.jacob@empa.ch, Tel. +41-58-765 42 88
- and
- EM Microelectronic-Marin SA, CH-2074 Marin-Epagnier, Switzerland
- Tel. +41-32-755 53 27
- 83_40771
- 84_40984
- 85_40998
- 86_41003
- 87_41079_resized
- 88_40918
- 89_40962
- 90_41029
- 91_40950
- 92_40971
- 93_40825
- TitlePage_2015
- Copyright
- Copyright ( 2015 by ASM International® All rights reserved
- 01-EDFAS 2015 Board of Directors
- 02-Organizing Committee-2015
- 03-Symposium Committee 2015.
- Notes:
- Cover title.
- Description based on online resource; title from PDF title page (ebrary, viewed March 14, 2016).
- ISBN:
- 1-5231-0206-3
- 1-62708-103-8
- OCLC:
- 940934393
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