Materials and failures in MEMS and NEMS / edited by Atul Tiwari and Baldev Raj.

Format:

• Book

Contributor:

• Tiwari, Atul, editor.
• Raj, Baldev, 1947- editor.

Series:

• Materials Degradation and Failures Series

Language:

English

Subjects (All):

• Microelectromechanical systems--Design and construction.
• Nanoelectromechanical systems--Design and construction.

Physical Description:

1 online resource (487 p.)

Edition:

1st ed.

Place of Publication:

Salem, Massachusetts ; Hoboken, New Jersey : Scrivener Publishing : Wiley, 2015.

Language Note:

English

Summary:

The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as well as on the properties of these devices. Important properties such as residual stresses and buckling behavior in the devices are discussed as separate chapters. Various models have been included in the chapters that studies the mode and mechanism of failure of the MEMS and NEMS. This book is meant for the graduate students, research scholars and engineers who are involved in the research and developments of advanced MEMS and NEMS for a wide variety of applications. Critical information has been included for the readers that will help them in gaining precise control over dimensional stability, quality, reliability, productivity and maintenance in MEMS and NEMS. No such book is available in the market that addresses the developments and failures in these advanced devices.

Contents:

• Intro
• Half Title page
• Title page
• Copyright page
• Preface
• Chapter 1: Carbon as a MEMS Material
• 1.1 Introduction
• 1.2 Structure and Properties of Glassy Carbon
• 1.3 Fabrication of C-MEMS Structures
• 1.4 Integration of C-MEMS Structures with Other Materials
• 1.5 Conclusion
• References
• Chapter 2: Intelligent Model-Based Fault Diagnosis of MEMS
• 2.1 Introduction
• 2.2 Model-Based Fault Diagnosis
• 2.3 Self-Tuning Estimation
• Chapter 3: MEMS Heat Exchangers
• 3.1 Introduction
• 3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer
• 3.3 MEMS Heat Sinks
• 3.4 MEMS Heat Pipes
• 3.5 Two-Fluid MEMS Heat Exchanger
• 3.6 Need for Microscale Internal Flow Passages
• Nomenclature
• Greek Alphabets
• Subscripts
• Chapter 4: Application of Porous Silicon in MEMS and Sensors Technology
• 4.1 Introduction
• 4.2 Porous Silicon in Biosensors
• 4.3 Porous Silicon for Pressure Sensors
• 4.4 Conclusion
• Chapter 5: MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface
• 5.1 Introduction
• 5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force
• 5.3 Vertically Actuated U-Shape Nanowire NEMS Switch
• 5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics
• 5.5 Summary
• Chapter 6: On the Design, Fabrication, and Characterization of cMUT Devices
• 6.1 Introduction
• 6.2 cMUT Design and Finite Element Modeling Simulation
• 6.3 cMUT Fabrication and Characterization
• 6.4 Summary and Conclusions
• Acknowledgments
• Chapter 7: Inverse Problems in the MEMS/NEMS Applications
• 7.1 Introduction
• 7.2 Inverse Problems in the Micro/Nanomechanical Resonators
• 7.3 Inverse Problems in the MEMS Stiction Test
• Acknowledgment
• References.
• Chapter 8: Ohmic RF-MEMS Control
• 8.1 Introduction
• 8.2 Charge Drive Control (Resistive Damping)
• 8.3 Hybrid Drive Control
• 8.4 Control Under High-Pressure Gas Damping
• 8.5 Comparison between Different Control Modes
• Chapter 9: Dynamics of MEMS Devices
• 9.1 Introduction
• 9.2 Modeling and Simulation
• 9.3 Fabrication Methods
• 9.4 Characterization
• 9.5 Device Failures
• Chapter 10: Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate
• 10.1 Introduction
• 10.2 Buckling Behaviors of Constantan Wire under Electrical Loading
• 10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate
• 10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire
• 10.5 Conclusions
• Chapter 11: Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications
• 11.1 Introduction
• 11.2 Operation Principle and Fundamental Models
• 11.3 Microcantilever Sensor Fabrication
• 11.4 Mechanical and Electrical Characterization of Microcantilevers
• 11.5 Readout Principles
• 11.6 Application of Microcantilever Sensors
• 11.7 Energy Harvesting for Sensor Networks
• 11.8 Conclusion
• Chapter 12: CMOS MEMS Integration
• 12.1 Introduction
• 12.2 State-of-the-Art inertial Sensor
• 12.3 Capacitance Sensing Techniques
• 12.4 Capacitance Sensing Architectures
• 12.5 Continuous Time Voltage Sensing Circuit
• 12.6 CMOS ASIC Design
• 12.7 Test Results of CMOS-MEMS Integration
• 12.8 Electrical Reliability Issues
• Chapter 13: Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data
• Abbreviations
• 13.1 Introduction
• 13.2 Notations and Assumptions.
• 13.3 Reliability Model
• 13.4 Numerical Example
• 13.5 Conclusions
• Index.

Notes:

• Description based upon print version of record.
• Includes bibliographical references at the end of each chapters and index.
• Description based on print version record.

ISBN:

• 9781119083863
• 1119083869
• 9781119083887
• 1119083885
• 9781119083870
• 1119083877

OCLC:

927509309