Microwave and millimeter-wave electronic packaging / Rick Sturdivant.

Format:

Book

Author/Creator:

Sturdivant, Rick, author.

Series:

Artech House microwave library.

Artech House Microwave Library

Language:

English

Subjects (All):

Microelectronic packaging.

Physical Description:

1 online resource (281 p.)

Edition:

1st ed.

Distribution:

[Piscataqay, New Jersey] : IEEE Xplore, [2013]

Place of Publication:

Boston [Massachusetts] ; London [England] : Artech House, 2014.

Language Note:

English

Summary:

Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. -- Edited summary from book.

Contents:

Introduction

Materials

Ceramic packaging

Laminate packaging

First-level interconnects

Second-level interconnects

Modules and motherboards

Transitions and 3D packaging

Heat transfer

Electromagnetic modeling

Conclusions and future horizons.

Notes:

Description based upon print version of record.

Includes bibliographical references at the end of each chapters and index.

Description based on print version record.

ISBN:

1-5231-1742-7

1-60807-698-9

OCLC:

905527317