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Advanced materials and processing 2010 : proceedings of the 6th International Conference on ICAMP, Yunnan, PR China, 19-23 July, 2010 / edited by Y.F. Zhang ... [et al.].

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Format:
Book
Conference/Event
Author/Creator:
International Conference on Advanced Materials Processing, Corporate Author.
Contributor:
Zhang, Y. F.
Conference Name:
International Conference on Advanced Materials Processing (6th : 2010 : Yunnan Sheng, China)
International Conference on Advanced Materials Processing
Language:
English
Subjects (All):
Materials--Congresses.
Materials.
Manufacturing processes--Congresses.
Manufacturing processes.
Physical Description:
1 online resource (360 p.)
Edition:
1st ed.
Place of Publication:
Singapore ; London : World Scientific, c2011.
Language Note:
English
Summary:
The proceedings cover the latest research in advanced materials such as design, synthesis and development of new materials, processing technology for new materials, and modeling and simulation of materials processing.
Contents:
PREFACE; CONTENTS; STRAIN SENSORS MADE FROM MWNT/POLYMER NANOCOMPOSITES; 1. Introduction; 2. Experimental Study on Influences of CNTs on Sensor Piezoresistivity; 3. Experimental and Numerical Investigations on MWNT-7/epoxy Sensor; 4. Conclusion; References; SHEAR BAND EVOLUTION AND NANOSTRUCTURE FORMATION IN TITANIUM BY COLD ROLLING; 1. Introduction; 2. Experimental Procedure; 3. Results and Discussion; 3.1. TEM quantification of the microstructure refinement within shear bands; 3.2. TEM study of the microstructure refinement mechanisms within shear bands; 4. Conclusion; References
BIODEGRADABLE Mg-Zr-Ca ALLOYS FOR BONE IMPLANT MATERIALS1. Introduction; 2. Experimental Procedures; 3. Results and Discussion; 4. Conclusion; Acknowledgments; References; HYDROXYAPATITE SYNTHESIZED FROM NANOSIZED CALCIUM CARBONATE VIA HYDROTHERMAL METHOD; 1. Introduction; 2. Experimental Method; 3. Results and Discussion; 4. Conclusion; References; MODELING OF THE MAGNETIZATION PROCESS AND ORTHOGONAL FLUXGATE SENSITIVITY OF FERROMAGNETIC MICRO-WIRE ARRAYS; 1. Introduction; 2. Modeling of Hysteresis Loops; 2.1. Experimental measurement; 2.2. Hysteresis loop model
3. Modeling of Sensor Sensitivity4. Conclusion; References; FABRICATION OF SILICON OXIDE NANOWIRES ON Ni COATED SILICON SUBSTRATE BY SIMPLE HEATING PROCESS; 1. Introduction; 2. Experimental Details; 3. Results and Discussion; 4. Conclusion; Acknowledgments; References; DEPOSITION OF TiOxNy THIN FILMS WITH VARIOUS NITROGEN FLOW RATE: GROWTH BEHAVIOR AND STRUCTURAL PROPERTIES; 1. Introduction; 2. Experimental Method; 3. Results and Discussion; 4. Conclusion; Acknowledgments; References; OBSERVATION ON PHOTOLUMINESCENCE EVOLUTION IN 300 keV SELF-ION IMPLANTED AND ANNEALED SILICON
1. Introduction2. Experimental Method; 3. Results and Discussion; 4. Conclusion; Acknowledgment; References; FACILE SYNTHESIS OF LITHIUM NIOBATE FROM A NOVEL PRECURSOR H2(H2O)Nb2O6; 1. Introduction; 2. Experimental Method; 3. Results and Discussion; 4. Conclusion; Acknowledgments; References; EFFECTS OF THE BUFFER LAYERS ON THE ADHESION AND ANTIMICROBIAL PROPERTIES OF THE AMORPHOUS ZrAlNiCuSi FILMS; 1. Introduction; 2. Experimental Method; 3. Results and Discussion; 3.1. Adhesion; 3.2. Nanostructure; 3.3. Antimicrobial effects; 3.4. Contact angle tests; 4. Conclusion; Acknowledgments
ReferencesFABRICATION OF ZnO NANORODS BY ELECTROCHEMICAL DEPOSITION PROCESS AND ITS PHOTOVOLTAIC PROPERTIES; 1. Introduction; 2. Experimental Method; 3. Results and Discussion; 4. Conclusion; Acknowledgments; References; CRYOGENIC RESISTIVITIES OF NbTiAlVTaLax, CoCrFeNiCu AND CoCrFeNiAl HIGH ENTROPY ALLOYS; 1. Introduction; 2. Experimental Method; 3. Results and Discussion; 4. Conclusion; Acknowledgments; References; MODELING OF CENTRIFUGAL FORCE FIELD AND THE EFFECT ON FILLING AND SOLIDIFICATION IN CENTRIFUGAL CASTING; 1. Introduction; 2. Mathematical Model; 3. Results and Discussion
4. Conclusion
Notes:
"This special issue in Modern Physics Letters B ..."--Back cover.
Includes bibliographical references.
ISBN:
9786613433480
9781283433488
1283433486
9789814322799
9814322792
OCLC:
775586169

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