Cost-driven design of smart microsystems / Michael Niedermayer.

Format:

Book

Author/Creator:

Niedermayer, Michael, 1971-

Series:

Artech House integrated microsystems series.

Artech House integrated microsystems series

Language:

English

Subjects (All):

Microelectromechanical systems.

Intelligent control systems--Design and construction.

Intelligent control systems.

Physical Description:

1 online resource (242 p.)

Edition:

1st ed.

Place of Publication:

Boston : Artech House, c2012.

Language Note:

English

System Details:

data file

Summary:

Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants.

Contents:

Cost-Driven Design of Smart Microsystems; Contents; Preface; 1 Introduction; References; 2 Design Methodologies; 2.1 Design Strategies; 2.2 Design of Embedded Systems; 2.2.1 Design Strategies for Digital Circuits; 2.2.2 Design Strategies for Analog Circuits; 2.3 Design of Electronic Components and Microsystems; 2.4 Design of Modules with Heterogeneous Components; 2.5 Design of Communication Protocols; 2.6 Design Models for Smart Microsystems; References; 3 Fabrication Processes; 3.1 Semiconductor Technologies; 3.1.1 Wafer Fabrication; 3.1.2 Wafer Test; 3.1.3 Chip Packaging and Class Test

3.2 Module Integration Technologies3.2.1 Fabrication of Module Substrates; 3.2.2 Assembly and Interconnection; 3.2.3 Passivation and Encapsulation Technologies; 3.3 Process Modeling; References; 4 Physical Design Decisions; 4.1 Basic Elements of Module Integration; 4.1.1 Wiring Capacity of Substrates; 4.1.2 Module Systems; 4.2 Placement and Routing; 4.2.1 Component Arrangement; 4.2.2 Component Wiring; 4.2.3 Ensuring the Signal Integrity; 4.3 Determination of the Miniaturization Potential; 4.3.1 Volume Aggregation Lists; 4.3.2 Simplified Geometry Models; 4.3.3 Adapted Geometry Models

5.5.2 Optimization of Digital Architectural ElementsReferences; 6 Leverage Effects of the Functional Design; 6.1 Properties of the Surrounding Medium; 6.1.1 Concentrated and Distributed Phenomena; 6.1.2 Signal Propagation; 6.1.3 Interferences; 6.1.4 Modeling of Environmental Influences; 6.2 Radio Communications; 6.2.1 Modulation Schemes; 6.2.2 Media Access Schemes; 6.2.3 Logical Link Control; 6.2.4 Network Control; 6.3 Distributed Data Acquisition; 6.3.1 Localization; 6.3.2 Synchronization and Calibration; 6.4 Determination of Functional Optimization Potential

6.4.1 Aggregation Lists of System Parameters6.4.2 Simplified System Models; 6.4.3 Adapted System Models; References; 7 Cost Fundamentals; 7.1 Basic Cost Categories; 7.2 Approaches of Cost Estimation; 7.2.1 Cost Determination of Fabrication Processes; 7.2.2 Cost Determination of System Components; 7.3 Direct Component Costs; 7.3.1 Determination of Cost-Driving Function Components; 7.3.2 Determination of Costs for Module Integration; 7.4 Indirect Costs of Product Development; 7.4.1 Development Effort of Hardware; 7.4.2 Development Effort of Software

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

9781608070855

1608070859

OCLC:

793193092