Lead-free solder interconnect reliability / edited by Dongkai Shangguan.

Format:

Book

Contributor:

Shangguan, Dongkai, 1963-

Language:

English

Subjects (All):

Microelectronic packaging--Reliability.

Microelectronic packaging.

Solder and soldering.

Lead-free electronics manufacturing processes.

Physical Description:

1 online resource (302 p.)

Edition:

1st ed.

Place of Publication:

Materials Park, OH : ASM International, 2005.

Language Note:

English

Summary:

This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. This book is the first comprehensive guide to reliability of lead-free solder interconnects.

Contents:

""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""

""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

1-61503-093-X

OCLC:

729262390