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Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors.
- Format:
- Book
- Series:
- Artech House integrated microsystems series.
- Integrated microsystems series
- Language:
- English
- Subjects (All):
- Interconnects (Integrated circuit technology).
- Nanoelectronics.
- Telecommunication systems.
- Physical Description:
- 1 online resource (550 p.)
- Edition:
- 1st ed.
- Place of Publication:
- Boston, Mass. ; London : Artech House, c2009.
- Language Note:
- English
- Summary:
- This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.
- Contents:
- Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling.
- Notes:
- Description based upon print version of record.
- Print version record.
- Includes bibliographical references and index.
- ISBN:
- 1-59693-247-3
- OCLC:
- 434509565
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