NDT New Technology & Application Forum (FENDT), 2015 IEEE Far East / Institute of Electrical and Electronics Engineers (IEEE).

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers (IEEE), author, issuing body.

Language:

English

Subjects (All):

Nondestructive testing--Technological innovations--Congresses.

Nondestructive testing.

Physical Description:

1 online resource : illustrations

Other Title:

2015 IEEE Far East NDT New Technology & Application Forum (FENDT)

2015 IEEE Far East NDT New Technology & Application Forum

NDT New Technology & Application Forum

Place of Publication:

Piscataway, New Jersey : Institute of Electrical and Electronics Engineers (IEEE), 2015.

Summary:

The 12th FENDT (2015) will be held in Zhuhai, Guangdong province on May 28 31, 2015. Aiming at strengthening academic communication and promoting the innovation development of nondestructive testing, the International Far East Forum on Nondestructive Evaluation Testing (FENDT) has become the most important event for Nondestructive Evaluation Testing in China since its inception in Nangjing, 2004. The forum assembles all the professionals such as leading researchers, engineers, scientists, industrial people and students worldwide under one roof every year It is a great platform for sharing experiences, innovative ideas, industrial progresses and research results in the field of Ultrasonic Evaluation Testing, Magnetic particle Testing, Radiographic Testing and Eddy current Testing, NDT Image Processing Technology, Infrared, Laser and Microwave Detection Technology etc. The conference also provides a showcase platform for companies to exhibit their latest technology and products.

Notes:

Description based on publisher supplied metadata and other sources.

ISBN:

1-4673-7001-0