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Proceedings / International Advanced Packaging Materials Symposium.

IEEE Xplore (IEEE/IET Electronic Library - IEL) Available from 1997. Available online

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Format:
Conference/Event
Journal/Periodical
Contributor:
Components, Packaging & Manufacturing Technology Society.
Georgia Institute of Technology. Packaging Research Center.
Conference Name:
International Advanced Packaging Materials Symposium.
Language:
English
Subjects (All):
Electronic packaging--Materials--Congresses.
Electronic packaging.
Electronic packaging--Materials.
Genre:
Conference papers and proceedings.
Physical Description:
1 online resource
Biennial
Continued By:
... IEEE International Symposium on Advanced Packaging Materials
Place of Publication:
Piscataway, NJ : IEEE Service Center
Notes:
Sponsored by: IEEE Components, Packaging and Manufacturing Technoiogy [and] Georgia Tech Packaging Research Center.
Surrogate of: 8th (2002).
Constituent Unit:
2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005
Other Format:
Print version: Proceedings /

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