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2016 International Conference on Electronics Packaging (ICEP) : 20-22 April 2016, Hokkaido, Japan / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (692 pages) : illustrations
- Other Title:
- 2016 International Conference on Electronics Packaging
- Place of Publication:
- Piscataway, New Jersey : IEEE, [2016]
- Summary:
- ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 4-904090-17-9
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