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2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
- Place of Publication:
- Piscataway, NJ : IEEE, 2016.
- Summary:
- Annotation This unique single meeting event brings together participants interested in MEMS MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS MOEMS All aspects including design, modeling, testing, micro machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-5090-1457-8
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