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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) : May 31 - June 3, 2016, Las Vegas, NV USA / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Ball grid array technology.
- Heat sinks (Electronics)--Design and construction.
- Heat sinks (Electronics).
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
- Place of Publication:
- Piscataway, NJ : IEEE, 2016.
- Summary:
- Scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
- Contents:
- [Front cover]
- [Title page]
- [Copyright notice]
- Organizing Committee
- Paper reviewers
- Table of contents
- Experiment on evaporation heat transfer performance of porous surface
- Thermal behavior of water-copper and water-stainless steel heat pipes operating in cycles
- A review on thermal performance of CuO-water nanofluids applied to heat pipes and their characteristics
- Detailed thermal resistance model for characterization of the overall effective thermal conductivity of a flat heat pipe
- Optimization of hybrid wick structures for extreme spreading in high performance vapor chambers.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781467381215
- 1467381217
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