1 option
CMP Technology : International Conference on Planarization : 25-27 October 2007.
- Format:
- Book
- Author/Creator:
- Verband der Elektrotechnik, author, issuing body.
- Language:
- English
- Subjects (All):
- Grinding and polishing--Congresses.
- Grinding and polishing.
- Physical Description:
- 1 online resource (493 pages)
- Place of Publication:
- Frankfurt am Main, Germany : VDE, 2011.
- Notes:
- Description based on: online resource; title from title screen (IEEE Xplore Digital Library, viewed March 22, 2018).
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