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2014 International Conference on Electronics Packaging (ICEP) / IEEE Staff.
- Format:
- Book
- Author/Creator:
- IEEE Staff, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource
- Other Title:
- 2014 International Conference on Electronics Packaging
- 2014 International Conference on Electronics Packaging (ICEP)
- Electronics Packaging
- Place of Publication:
- Piscataway, NJ : IEEE, 2014.
- Summary:
- Annotation ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 4-904090-11-X
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