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CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Design and construction--Congresses.
- Electronic apparatus and appliances.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2013 3rd IEEE CPMT Symposium Japan
- CPMT Symposium Japan
- Place of Publication:
- Piscataway, NJ : IEEE, 2013.
- Summary:
- The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses on the most leading edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging, Optoelectronics Packaging and Wafer level Packaging within Materials and Electrical Performance & Thermal Management.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-4799-0877-0
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