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2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Format:
- Book
- Author/Creator:
- IEEE Staff, Corporate Author.
- Language:
- English
- Subjects (All):
- Photonics--Materials--Congresses.
- Photonics.
- Three-dimensional integrated circuits.
- Sealing (Technology)--Congresses.
- Sealing (Technology).
- Physical Description:
- 1 online resource (262 pages) : illustrations
- Place of Publication:
- [Place of publication not identified] IEEE 2012
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 9781467307420
- 1467307424
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