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2011 IEEE 29th VLSI Test Symposium
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Integrated circuits--Very large scale integration--Testing--Congresses.
- Integrated circuits.
- Physical Description:
- 1 online resource (328 pages) : illustrations
- Place of Publication:
- [Place of publication not identified] IEEE 2011
- Language Note:
- English
- Contents:
- Foreword
- Organizing Committee
- Program Committee
- Steering Committee
- Reviewers
- Acknowledgements
- Test Technology Technical Council (TTTC)
- Test Technology Educational Program (TTEP) Tutorials
- Awards
- Session 1 Session 1A: Post-Silicon Debug & Customer returns
- Session 1B: 3D ICS
- IP Session 1C: Test and Characterization of High-Speed Circuits
- Session 2 Session 2A: Power Issues in Test
- Session 2B: Analog, Mixed-Signal & RF Test/Diagnosis
- IP Session 2C: On Chip Parametric Sensors
- Session 3 Session 3A: Delay & Performance Test 1
- Special Session 3B: Hot Topic: Multifaceted Approaches for Field Reliability
- IP Session 3C: Advanced Methods for Leveraging New Test Standards
- Session 4 Special Session 4A: New Topics
- Session 4B: Panel: Security
- IP Session 4C: The Buck Stops With Wafer Test: Dream Or Reality?
- Session 5 Special Session 5A: Apprentice, Season 4
- Special Session 5B: Panel: How Much Toggle Activity Should We Be Testing With?
- Session 6 Session 6A: Delay & Performance Test 2
- Session 6B: Memory Test and Repair
- IP Session 6C: The Bang For The Buck With Resiliency: Yield Or Field?
- Session 7 Session 7A: Low-Power IC Test
- Session 7B: On-line & System Testing
- Session 8 Session 8A: Aging, Transients & Soft Errors
- Special Session 8B: New Topic: Solar Cells
- Sessions 9 Special Session 9C: Panel: Coverage Closure in SoC Verification: Are We Chasing a Mirage?
- Session 10 Session 10A: Design for Testability 1
- Session 10B: Error & Fault Tolerance 1
- Session 11 Session 11A: Design for Testability 2
- Session 11B: Error & Fault Tolerance 2
- Session 12 Session 12A: ATPG & Compression
- Session 12B: Reducing Test & Diagnosis Costs
- Session 13 Special Session 13A: Practical Signal Processing at Mixed Signal Test Venues - Trend Removal, Noise Reduction, Wideband Signal Capturing
- Session 13B: Hot Topic: Smart Silicon
- Session 13C: Hot Topic: Design and Test of 3D and Emerging Memories.
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 9781612846569
- 1612846564
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