2010 IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers, author, issuing body.

Contributor:

ieee, Contributor.

Language:

English

Subjects (All):

Electrical engineering--Congresses.

Electrical engineering.

Physical Description:

1 online resource

Place of Publication:

[Place of publication not identified] IEEE 2010

Language Note:

English

Summary:

This paper presents a new and innovative methodology for power components manufacturers to generate accurate boundary condition independent dynamic Compact Thermal Models ("BCI" DCTMs). The originality of this methodology summarized by: taking into account of the thermal behavior of electronic components containing several cooling surfaces, and representing the non-linear properties of materials, while keeping a simple and recurring structure of generated models. Moreover, the dependence of dissipated power on temperature is considered. The proposed method makes it possible to obtain DCTMs with a limited number of measurements or 3D thermal simulations. The methodology to build the DCTM is based on the extraction of equivalent thermal RC network. The precision of the RC thermal network is improved by using variable resistances and capacitances related to the heat fluxes so that the compact model can adapt its parameters automatically with boundary conditions.

Notes:

Bibliographic Level Mode of Issuance: Monograph

ISBN:

9781424485796

1424485797