2009 IEEE Workshop on Signal Propagation on Interconnects

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers, author, issuing body.

Contributor:

IEEE Staff, Contributor.

Language:

English

Subjects (All):

Signal theory (Telecommunication)--Congresses.

Signal theory (Telecommunication).

Printed circuits--Congresses.

Printed circuits.

Physical Description:

1 online resource

Place of Publication:

[Place of publication not identified] IEEE 2009

Language Note:

English

Summary:

We introduce a novel parametrization scheme for lossy and dispersive multiconductor transmission lines (MTLs) having a cross-section depending on geometrical and physical parameters, that is suitable to interconnect modeling. The proposed approach is based on the dyadic Green's function method for the analysis of lossy and dispersive MTLs which is parameterized by using the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. Design parameters, such as substrate or geometrical layout features, in addition to frequency, can be easily handled. The rational form of the multi-port macromodel describing the MTL is a direct consequence of the MOVF technique and is especially suited to generate state-space macromodels or to be synthesized into equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. A numerical example is presented providing evidence of the accuracy of the proposed approach in both frequency and time-domain.

Notes:

Bibliographic Level Mode of Issuance: Monograph

ISBN:

9781509068654

1509068651

9781424444892

1424444896