1 option
2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 9-11 April 2008.
- Format:
- Book
- Conference/Event
- Conference Name:
- Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS (2008 : Nice, France)
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Micromachining--Congresses.
- Micromachining.
- Physical Description:
- 1 online resource (392 pages)
- Place of Publication:
- New York : IEEE, 2009.
- Notes:
- Includes index.
- Description based on: online resource; title from title screen (IEEE Xplore Digital Library, viewed March 6, 2018).
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.