2010 IEEE 14th Workshop on Signal Propagation on Interconnects

Format:

Book

Author/Creator:

IEEE Workshop on Signal Propagation on Interconnects, author.

Contributor:

IEEE Staff, Contributor.

Language:

English

Subjects (All):

Signal theory (Telecommunication)--Congresses.

Signal theory (Telecommunication).

Physical Description:

1 online resource

Place of Publication:

[Place of publication not identified] I E E E 2010

Language Note:

English

Summary:

The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.

Notes:

Bibliographic Level Mode of Issuance: Monograph

ISBN:

9781424476107

1424476100