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2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / compiled by Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Conference/Event
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author.
- Conference Name:
- International Microsystems, Packaging, Assembly & Circuits Technology Conference (3rd : 2008 : Taipei, Taiwan)
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Physical Description:
- 1 online resource (423 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2008.
- Notes:
- Description based on: online resource; title from cover (IEEE, viewed March 4, 2020).
- ISBN:
- 1-5090-8060-0
- 1-4244-3624-9
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