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2008 IEEE 9th VLSI Packaging Workshop of Japan
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers (IEEE), author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Integrated circuits--Very large scale integration--Congresses.
- Integrated circuits.
- Physical Description:
- 1 online resource
- Place of Publication:
- [Place of publication not identified] I E E E 2008
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 9781424434978
- 1424434971
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