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2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (549 pages)
- Place of Publication:
- [Place of publication not identified] I E E E 2005
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 9781509099245
- 1509099247
- 9780780392939
- 0780392930
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