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Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on / IEEE.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Electronics--Materials--Congresses.
- Electronics.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- Microelectronics and Electronics
- 2006 International Conference on Electronic Materials and Packaging
- Place of Publication:
- Piscataway, N.J. : IEEE, 2006.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-5090-9381-8
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