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Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics : Odaiba, Tokyo, Japan, January 15-18, 2007 s / IEEE Components, Packaging and Manufacturing Technology Society.
- Format:
- Book
- Conference/Event
- Conference Name:
- International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (6th : 2007 : Tokyo, Japan)
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Materials--Congresses.
- Microelectronic packaging.
- Polymers--Congresses.
- Polymers.
- Integrated circuits--Reliability--Congresses.
- Integrated circuits.
- Photonics--Materials--Congresses.
- Photonics.
- Polymeric composites--Congresses.
- Polymeric composites.
- Other Title:
- Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
- Electronics Communications and Computers
- Place of Publication:
- IEEE
- ISBN:
- 9781509089925
- 1509089926
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