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Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Microelectronics--Congresses.
- Microelectronics.
- Physical Description:
- 1 online resource
- Other Title:
- Principles of Engineering Service Oriented Systems
- 2007 International Microsystems, Packaging, Assembly and Circuits Technology
- Place of Publication:
- Piscataway, NJ : IEEE, 2007.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781509089420
- 150908942X
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