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ITHERM 2006 : Thermal and Thermomechanical proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 : May 30, 2006-June 2, 2006.
LIBRA QC611.6.T4 I232 6th (1990), 1992, 1994, 1996
Available from offsite location
- Format:
- Book
- Conference/Event
- Conference Name:
- InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (10th : 2006 : San Diego, Calif.)
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Thermal properties--Congresses.
- Electronic apparatus and appliances.
- Heat sinks (Electronics)--Congresses.
- Heat sinks (Electronics).
- Ball grid array technology--Congresses.
- Ball grid array technology.
- Physical Description:
- 1 online resource (200 pages)
- Contained In:
- Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018 17th IEEE Intersociety Conference on 1087-9870
- Place of Publication:
- New York : IEEE, 2006.
- Notes:
- Description based on: online resource; title from title screen (IEEE Xplore Digital Library, viewed March 24, 2018).
- ISBN:
- 1-5090-9087-8
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