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EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan : [proceedings
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Electronic packaging--Materials--Congresses.
- Physical Description:
- 1 online resource (vi, 301 pages)
- Place of Publication:
- [Place of publication not identified] IEEE 2005
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- ISBN:
- 9781509099559
- 1509099557
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