53rd Conference Electronic Components and Technology

Format:

Book

Author/Creator:

IEEE Components, Packaging and Manufacturing Technology Society Staff, Corporate Author.

Language:

English

Subjects (All):

Electronic industries--Congresses.

Electronic industries.

Physical Description:

1 online resource (1904 pages)

Place of Publication:

[Place of publication not identified] I E E E 2003

Language Note:

English

Contents:

Leading Edge Packaging Technology;

Pb-Free Interconnections;

Quality and Reliability Issues of Portable Products;

High-Density Substrates and Embedded Components;

Leaded and Lead-Free Solder Characterization and Modeling;

Application of Statistical Tools in Manufacturing for Inprocess Control, Test and Product Cycle;

Optoelectronic Modules;

Experimental Assessment of Quality and Reliability;

MEMS, Sensors and Microstructures;

Thermal and Thermo-Mechanical Modeling;

RF Modules and Performance Novel Packaging Education Programs;

Flip Chip Packaging;

Advances in Test Methods;

Electrical Modeling;

3D Packaging Technologies;

Novel Interconnections.

Notes:

Bibliographic Level Mode of Issuance: Monograph