Copper alloys : preparation, properties and applications / Michael Naboka and Jennifer Giordano, editors.

Format:

Book

Contributor:

Naboka, Michael.

Giordano, Jennifer.

Series:

Materials science and technologies series.

Materials science and technologies

Language:

English

Subjects (All):

Copper alloys--Metallurgy.

Copper alloys.

Physical Description:

1 online resource (281 p.)

Edition:

1st ed.

Place of Publication:

Hauppauge, N.Y. : Nova Science Publishers, c2011.

Language Note:

English

Summary:

This books presents current research in the study of the preparation, properties and applications of copper alloys. Topics discussed include the electrodeposition of copper based alloys for giant magneto resistance applications; the mechanical properties of copper under dynamic load; copper alloy micro-structures for application in microreactors and high strength copper-based conductor materials.

Contents:

Intro

COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS

CONTENTS

PREFACE

Chapter 1 ELECTROCATALYTIC OXIDATION OF METHANOL AND GLUCOSE ON NICU ALLOY ELECTRODE

ABSTRACT

1. INTRODUCTION

2. MATERIALS AND METHODS

3. RESULTS AND DISCUSSION

3.1. Surface Analysis of Electrodeposited NiCu Alloy

3.2. Electrochemical Behavior of GC/Ni and GC/NiCu in Alkaline Solution

3.3. Electro-Oxidation of Methanol

3.4. Electro-Oxidation of Glucose

CONCLUSION

REFERENCES

Chapter 2 ELECTRODEPOSITION OF COPPER BASED ALLOYS AND MULTILAYER FOR GIANT MAGNETO RESISTANCE APPLICATIONS

INTRODUCTION

EXPERIMENTAL SURVEY

EFFECT OF NUMBER OF BILAYERS

EFFECT OF MAGNETIC LAYER THICKNESS ON THE GMR

EFFECT OF NON-MAGNETIC LAYER THICKNESS ON THE GMR

CO-CU/CU MULTILAYER FILMS

Ni-Cu/Cu Multilayer Films

Co-Ni-Cu/Cu Multilayer Films

Fe-Co-Cu/Cu Multilayer Films

Fe-Ni-Cu/Cu Multilayer Films

Co-Zn-Cu/Cu Multilayer Films

Fe-Co-Ni-Cu/Cu Multilayer Films

Chapter 3 DEVELOPMENT AND CHARACTERIZATION OF NICKEL-COPPER-BASED SUBSTRATES FOR 2ND GENERATION HIGH-CRITICAL TEMPERATURE SUPERCONDUCTING TAPES

EXPERIMENTAL

RECRYSTALLIZATION TEXTURE

Pure Copper

Binary Nickel-Copper

Ternary Ni-Cu-Co Alloy

Ternary Ni-Cu-W Alloy

MAGNETIC PROPERTIES

OXIDATION BEHAVIOUR

MECHANICAL PROPERTIES

APPLICATION OF NI-CU-CO ALLOY TEXTURED SUBSTRATE FOR YBCO FILM DEPOSITION

ACKNOWLEDGMENT

Chapter 4 MAGNETORESISTANCE EFFECTS IN CU AND CO, CO/CU MULTILAYERS AND GRANULAR CU-CO ALLOYS AND IN RAPIDLY QUENCHED GD-DOPED CU-CO ALLOYS

MAGNETORESISTANCE OF PURE COPPER.

MAGNETORESISTANCE OF ALLOYS AND COMPOSITES COPPER - COBALT

MAGNETORESISTANCE OF ALLOYS COPPER - COBALT - GADOLINIUM

ACKNOWLEDGMENTS

Chapter 5 MECHANICAL PROPERTIES OF COPPER UNDER DYNAMIC LOAD

ABBREVIATIONS

DEFINITION OF COOPER PROPERTIES BY KOLSKY METHOD

Experimental Apparatus for Dynamic Tests

Determination of the Dynamic Characteristics of Strength and Plasticity

RESULTS OF TESTS OF COPPER USING KOLSKY METHOD

CRITICAL SPALL STRENGTH OF COPPER

Experimental Apparatus for Slpall Strength Determination

Critical Spall Strength Determination

Durability of Copper at Explosive Jet High-Speed Stretching

Dynamic Viscosity and Cooper Relaxation Time Under Dynamic Load

Chapter 6 COPPER ALLOY MICROSTRUCTURES FOR APPLICATION IN MICROREACTORS

I. INTRODUCTION

II. EXPERIMENTAL

Materials, Processing and Characterization

III. RESULTS AND DISCUSSION

III.1. Zeolite Film Growth on Copper-Based Plates

III.2. Zeolite Film Growth on Brass Microchannels

III.3. Confined Zeolite Film Growth on Brass Microchannels

III.3. Zeolite Film Growth on Brass Microgrids

IV. MICROREACTOR ASSEMBLY WITH THE ZEOLITE/BRASS MICROSTRUCTURES

CONCLUSIONS

Chapter 7 COMPOSITE ELECTRODEPOSITS WITH C60 FULLERENE

RESULTS AND DISCUSSION

Chapter 8 INFLUENCE OF ALLOYING WITH NI, AL, ZN, SN AND AG ON THE ANNEAL HARDENING EFFECT IN SINTERED COPPER BASE ALLOYS

Cold Rolling

Anneal Hardening Effect

Chapter9HIGHSTRENGTHCOPPER-BASEDCONDUCTORMATERIALS

Abstract

1.GeneralAspectsofCu-BasedConductorMaterials

1.1.TheSpecificResistivity

1.2.HardeningofConductorMaterials.

1.3.CommonCu-basedConductorMaterials

1.3.1.Nickel-BasedPrecipitates

1.3.2.Iron-BasedPrecipitates

1.3.3.Titanium-BasedPrecipitates

1.3.4.Chromium-BasedPrecipitates

1.3.5.ComparisonoftheConstituents

2.Cu-AgAlloys

2.1.PrecipitationReaction

2.2.SeparatingMatrixGrains

2.3.ThirdElementAdditions

2.3.1.CuAgCeandCuAgY

2.3.2.CuAgNiandCuAgMg

2.3.3.CuAgCrandCuAgFe

2.3.4.CuAgZr

2.4.StrengthandConductivity

3.Cu-NbAlloys

3.1.SurpassingtheSolubilityLimits

3.2.PrecipitationReaction

3.3.MicrostructuresStability

3.4.StrengthandConductivity

4.SummaryandOutlook

Acknowledgment

References

Chapter 10 NEW MATERIALS FOR TECHNOLOGICAL APPLICATIONS FROM THE TI CR CU TERNARY SYSTEM

Background

From the Binaries Ti Cr, Ti Cu and Cr Cu to the Ternary Ti Cr Cu System

RESULTS

Phase Equilibria in the Ti Cr Cu System at 800 °C

The Pseudo Binary (Ti1 Xcrx)(Cr1 Ycuy)2 Phase

The Ternary Compound Ti3(Crxcu1 X)5

The Pseudo Binary (Ti1 Xcrx)2(Crycu1 Y)

The Pseudo Binary (Ti1 Xcux)(Crycu1 Y)

The Pseudo Binary Ti2(Crxcu1 X)3 and Ti3(Crxcu1 X)4

The Binary Ticu4 Phase

Metastable "Ti3Cu" and "Ticu3" Phases

Physical Properties of a Fcc Cu Solid Solution Phase and the Ternary Ti3CrCu4 Compound

CONCLUDING SUMMARY

Chapter 11 CHEMICAL MECHANICAL POLISHING OF COPPER ALLOYS

2. FUNDAMENTALS OF CHEMICAL MECHANICAL POLISHING

2.1. Material Removal Rate, MRR

2.2. Chemical Processes and Related Mechanisms of Material Removal

3. SLURRY COMPOSITIONS

4. POLISHING PAD DESIGN

INDEX.

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

Description based on print version record and CIP data provided by publisher.

ISBN:

1-62081-544-3

OCLC:

780443362