Signal integrity : from high speed to radiofrequency applications / Fabien Ndagijimana.

Format:

Book

Author/Creator:

Ndagijimana, Fabien, author.

Series:

Digital signal and image processing series.

Digital Signal And Image Processing Series

Language:

English

Subjects (All):

Radio frequency.

Radio frequency--Industrial applications.

Radio circuits.

Physical Description:

1 online resource (174 p.)

Edition:

1st edition

Place of Publication:

London, England ; Hoboken, New Jersey : iSTE : Wiley, 2014.

Language Note:

English

System Details:

text file

Summary:

This book presents the necessary concepts for the design and testing of radiofrequency and high-speed circuits. Signal and propagation theory is presented for the various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals of radiofrequency signals and supply circuits is developed in order to provide design rules for engineers and Masters-level students. The subjects covered include: interconnections and signal integrity; spectral analysis techniques for high-speed signals; design techniques for signal integrity; the transmission-line concept; methods f

Contents:

Cover; Title Page; Copyright; Contents; Introduction; Chapter 1. Degradation Of Rise Time In Interconnects; 1.1. Propagation issues in interconnects; 1.1.1. Evolution of digital circuits; 1.1.2. Evolution of signals in interconnects; 1.1.3. Propagation time on networks; 1.1.4. Propagation delay in integrated circuits; 1.1.5. Spectral analysis of signals; 1.2. Behavior of components at high frequencies; 1.2.1. Contact wire behavior; 1.2.2. Resistance behavior at radiofrequencies (RF); 1.2.3. RF inductance behavior; 1.2.4. Capacitance behavior at RF

1.2.5. Effects of losses due to conductors: skin effect1.3. Effect on transmission of signals on interconnects; 1.3.1. Filtering by transmission channel; 1.3.2. Degradation of rise time in a limited-bandwidth channel; 1.3.3. Example of a first-order low-pass RC filter; 1.3.4. Effects of resistive losses from skin effect; 1.3.5. Rise time in cascading circuits; 1.3.6. Transmission quality criteria: eye diagram; 1.4. Measurement of rise time; 1.4.1. Different definitions of rise time; 1.4.2. Measurement principle; 1.4.3. Effect of measuring sensor; 1.5. Conclusion

Chapter 2. Electromagnetic Modeling Of Interconnects2.1. Global modeling of signal integrity; 2.1.1. ICEM and ICIM models; 2.1.2. IBIS models; 2.1.3. I/V characteristics of buffers; 2.1.4. I/V characteristics of the IBIS model; 2.2. RC interconnect model; 2.2.1. RC model; 2.2.2. The Elmore constant; 2.3. Capacitive and inductive modeling; 2.3.1. Capacitive modeling; 2.3.2. Inductive modeling; 2.4. LC line modeling; 2.5. Application to electronic packages and MCM; 2.5.1. Different types of electronic packages; 2.5.2. Multichip modules; 2.5.3. LC modeling of packages

2.5.4. 2.5D and 3D electromagnetic simulations2.6. Conclusion; Chapter 3. Controlled Impedance Interconnects; 3.1. Why control impedance?; 3.1.1. Effect of interconnect length; 3.1.2. Classification of interconnects by the signal carried; 3.2. Influence of rise time on signal degradation; 3.3. Model of a controlled impedance interconnect; 3.3.1. Characteristic impedance: definition; 3.3.2. Configuration of controlled impedance interconnects; 3.4. Interconnects on PCBs; 3.4.1. Controlled impedance on PCB; 3.4.2. Transition between lines and discontinuity

3.4.3. Extraction of values from equivalent schema3.5. Impedance control for a microstrip configuration; 3.5.1. Effect of effective permittivity; 3.5.2. Limitations on a typical digital circuit; 3.5.3. Effect of ribbon thickness or protective resin; 3.6. Analysis of propagation in interconnects; 3.6.1. Reflection and transmission on termination; 3.6.2. Reflection and transmission during an impedance break; 3.6.3. Reflection and transmission on a bus; 3.7. Effect on data bus configuration; 3.8. Application to clock distribution; 3.9. Conclusion; Chapter 4. Propagation On Transmission Lines

4.1. Transmission line model

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

Description based on print version record.

ISBN:

9781118649183

1118649184

9781118649206

1118649206

9781118649190

1118649192

OCLC:

882248501