Microelectronics failure analysis : desk reference / edited by Richard J. Ross.

Format:

Book

Contributor:

Ross, Richard J.

Language:

English

Subjects (All):

Electronics--Materials--Testing--Handbooks, manuals, etc.

Electronics.

Microelectronics--Materials--Testing--Handbooks, manuals, etc.

Microelectronics.

Microelectronics--Materials--Defects--Handbooks, manuals, etc.

Electronic apparatus and appliances--Testing--Handbooks, manuals, etc.

Electronic apparatus and appliances.

Semiconductors--Defects--Handbooks, manuals, etc.

Semiconductors.

Physical Description:

1 online resource (672 p.)

Edition:

6th ed.

Place of Publication:

Materials Park, Ohio : ASM International, c2011.

Language Note:

English

System Details:

System requirements for accompanying CD-ROM: Windows 95/98/NT/ME/2000/XP ; Macintosh 8/9/Classic.

Summary:

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: * Failure Analysis Process Flow * Failure Verification * Failure Modes and Failure Classification * Special Devices (MEMS, Optoelectronics, Passives) * Fault Localisation Techniques: Package Level (NDT) * Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) * Deprocessing & Imaging Techniques: Deprocessing * General Imaging Techniques * Local Deprocessing & Imaging * Circuit Edit and Design Modification * Material Analysis Techniques * Reference Information: Important Topics for Semiconductor Devices * Failure Analysis Techniques Roadmap * Failure Analysis Operations and Management * Appendices: Failure Analysis Terms, Definitions, and Acronyms * Industry Standards

Contents:

section 1. Introduction

section 2. Failure analysis process overviews

section 3. Failure analysis topics

section 4. Fault verification and classification

section 5. Localization techniques

section 6. Deprocessing and sample preparation

section 7. Inspection

section 8. Materials analysis

section 9. Focused ion beam applications

section 10. Management and reference information.

Notes:

Description based upon print version of record.

Includes bibliographical references and indexes.

ISBN:

1-61503-726-8

1-61503-837-X

OCLC:

923571038