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IBM eserver pSeries 670 and pSeries 690 system handbook / [Keigo Matsubara, Alvin Hua Juay Teng, Bruno Blanchard].
- Format:
- Book
- Author/Creator:
- Matsubara, Keigo.
- Series:
- IBM redbooks.
- IBM redbooks
- Language:
- English
- Subjects (All):
- IBM computers--Programming.
- IBM computers.
- Web servers.
- UNIX (Computer file).
- Physical Description:
- xxii, 240 p. : ill.
- Edition:
- 3rd ed.
- Place of Publication:
- [United States?] : IBM, International Technical Support Organization, 2003.
- Language Note:
- English
- System Details:
- Mode of access: Internet via World Wide Web.
- Contents:
- Front cover
- Contents
- Figures
- Tables
- Notices
- Trademarks
- Preface
- The team that wrote this redbook
- Become a published author
- Comments welcome
- Summary of changes
- April 2003, Third Edition
- October 2002, Second Edition
- March 2002, First Edition
- Chapter 1. Overview of the pSeries 670 and pSeries 690
- 1.1 What's new in the pSeries 670 and pSeries 690
- 1.2 pSeries 670 and pSeries 690 characteristics
- 1.2.1 Microprocessor technology
- 1.2.2 Memory subsystem
- 1.2.3 I/O drawer subsystem
- 1.2.4 Hardware technology
- 1.3 Logical partitioning
- 1.4 Dynamic logical partitioning
- 1.5 General overview of pSeries 670 and pSeries 690
- 1.6 Market positioning
- 1.7 Supported operating systems
- 1.7.1 AIX 5L Version 5.1
- 1.7.2 AIX 5L Version 5.2
- 1.7.3 Linux - SuSE
- 1.7.4 Comparison of RAS supported features
- 1.7.5 Installation and backup of the operating systems
- Chapter 2. Hardware architecture of the pSeries 670 and pSeries 690
- 2.1 What's new in the pSeries 670 and pSeries 690
- 2.2 Modular design of the pSeries 670 and pSeries 690
- 2.3 Central Electronics Complex
- 2.3.1 POWER4 processor and MCM packaging
- 2.3.2 Memory subsystem for pSeries 690
- 2.3.3 MCMs and GX slots relationship for pSeries 690
- 2.3.4 Memory subsystem for pSeries 670
- 2.3.5 MCMs and GX slots relationship for pSeries 670
- 2.3.6 I/O books
- 2.3.7 Service processor
- 2.4 I/O subsystem
- 2.4.1 I/O drawer
- 2.4.2 I/O subsystem communication and monitoring
- 2.4.3 I/O drawer physical placement order
- 2.4.4 Media drawer
- 2.5 Power subsystem
- 2.5.1 Bulk power assembly
- 2.5.2 Internal battery feature
- 2.5.3 Cooling
- 2.6 IBM Hardware Management Console for pSeries
- Chapter 3. Using the IBM Configurator for e-business
- 3.1 What's new with e-config.
- 3.2 Configuration rules for pSeries 670 and pSeries 690
- 3.2.1 Minimum configuration for the pSeries 670 and pSeries 690
- 3.2.2 LPAR considerations
- 3.2.3 Processor configuration rules
- 3.2.4 Memory configuration rules
- 3.2.5 I/O books
- 3.2.6 Media drawer configuration rules
- 3.2.7 I/O drawer configuration rules
- 3.2.8 I/O loops and cabling
- 3.2.9 Graphics console configuration rules
- 3.2.10 Rack and power units configuration rules
- 3.2.11 HMC configuration rules
- 3.2.12 SP Cluster 1600 considerations
- 3.2.13 Upgrade considerations
- 3.3 IBM Configurator for e-business (e-config)
- 3.3.1 Initial order
- 3.3.2 Performing an upgrade
- 3.4 Configuration examples
- 3.4.1 Configuration example 1: pSeries 670 (16-way 1.1 GHz)
- 3.4.2 Configuration example 2: pSeries 690 (24-way 1.3 GHz)
- 3.4.3 Model conversion from pSeries 670 to pSeries 690
- 3.4.4 Feature conversion from POWER4 to POWER4+
- Chapter 4. Capacity Upgrade on Demand
- 4.1 What's new in CUoD
- 4.2 Description of CUoD
- 4.2.1 Trial CoD function
- 4.2.2 Overview of CUoD configurations
- 4.2.3 Supported CUoD Processor configurations
- 4.2.4 Supported CUoD Memory configurations
- 4.2.5 CUoD resource sequencing
- 4.2.6 Logical and physical entities
- 4.2.7 CUoD license screen
- 4.2.8 CUoD error messages
- 4.3 Activating CUoD resources
- 4.3.1 CUoD resources activation and order process
- 4.3.2 Trial CoD processor and memory
- 4.4 Dynamic Processor Sparing
- 4.5 On/Off Capacity on Demand
- Chapter 5. Reliability, availability, and serviceability
- 5.1 What's new in serviceability
- 5.2 RAS features
- 5.3 Predictive functions
- 5.3.1 Service processor
- 5.3.2 First Failure Data Capture (FFDC)
- 5.3.3 Predictive failure analysis
- 5.3.4 Component reliability
- 5.3.5 Extended system testing and surveillance
- 5.4 Redundancy in components.
- 5.4.1 Power and cooling
- 5.4.2 Memory redundancy mechanisms
- 5.4.3 Multiple data paths
- 5.5 Fault recovery
- 5.5.1 PCI bus parity error recovery and PCI bus deallocation
- 5.5.2 Dynamic CPU deallocation
- 5.5.3 CPU Guard
- 5.5.4 Caches and memory deallocation
- 5.5.5 Hot-swappable components
- 5.5.6 Hot-swappable boot disks
- 5.5.7 Hot-Plug PCI adapters
- 5.5.8 Light Path Diagnostics
- 5.6 Serviceability features
- 5.6.1 Back up of HMC
- 5.6.2 Upgrading HMC
- 5.6.3 Microcode Updates function
- 5.6.4 Inventory Scout Services
- 5.6.5 Service Agent
- 5.6.6 Service Focal Point
- 5.6.7 Problem determination hints of Service Functions
- 5.7 AIX RAS features
- 5.7.1 Unrecoverable error analysis
- 5.7.2 System hang detection
- 5.7.3 AIX disk mirroring and LVM sparing
- 5.7.4 TCP/IP RAS enhancements
- Appendix A. Minimum and default configurations
- A.1 pSeries 670 configurations
- A.2 pSeries 690 configurations
- Appendix B. I/O loop cabling and performance
- Abbreviations and acronyms
- Related publications
- IBM Redbooks
- Other publications
- Online resources
- How to get IBM Redbooks
- Index
- Back cover.
- Notes:
- Digitized and made available by: Books24x7.com.
- The "e" in "eserver" is printed as the symbol for electronic.
- "May 2003."
- "SG24-7040-02."
- Includes bibliographical references and index.
- OCLC:
- 939263538
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