Microelectromechanical systems : advanced materials and fabrication methods / Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Format:

Book

Author/Creator:

National Research Council (U.S.). Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems.

Language:

English

Subjects (All):

Microelectronics--Materials.

Microelectronics.

Microelectromechanical systems--Design and construction.

Microelectromechanical systems.

Physical Description:

1 online resource (75 p.)

Edition:

1st ed.

Place of Publication:

Washington, DC : National Academy Press, 1997.

Language Note:

English

Summary:

Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.

Contents:

Microelectromechanical Systems

Copyright

Acknowledgments

Preface

Contents

Acronyms

Executive Summary

LEVERAGING AND EXTENDING THE INTEGRATED CIRCUITS FOUNDATION

ENLARGING THE SUITE OF MATERIALS SUITABLE FOR INTEGRATED-CIRCUIT-LIKE PROCESSING

CHARACTERIZING MEMS MATERIALS

UNDERSTANDING SURFACE AND INTERFACE EFFECTS

ETCHING TECHNOLOGIES

ESTABLISHING STANDARD TEST DEVICES AND METHODS

MEMS PACKAGING

FOUNDRY AND COMPUTER-AIDED DESIGN INFRASTRUCTURE FOR MEMS

ACADEMIC STRUCTURE TO SUPPORT MEMS

1 Background

COMMERCIAL SUCCESSES

Thermal Ink-Jet Printing

Accelerometers

NEWLY INTRODUCED PRODUCTS

High-Resolution Displays

Chemical-Sensing Arrays

LONGER-RANGE OPPORTUNITIES

Transportation

Biomedical and Health Care

Information Technology

Defense

SUMMARY

2 Integrated Circuit-Based Fabrication Technologies and Materials

STRENGTHS OF THE INTEGRATED CIRCUIT PROCESS

USING EXISTING INTEGRATED CIRCUIT-BASED PROCESSES

Bulk Micromachining Processes

Bulk Micromachining for MEMS with Electronics

Surface Micromachining Processes

Surface Micromachining to Produce Multilevel MEMS

CLASSIFYING INTEGRATED CIRCUIT-BASED TECHNOLOGIES

MEMS with Old Materials and Old Tools

MEMS with Old Materials and New Tools

MEMS with New Materials and Old Tools

MEMS with New Materials and New Tools

3 New Materials and Processes

MOTIVATIONS FOR NEW TECHNOLOGIES

MATERIALS AND PROCESSES FOR HIGH-ASPECT-RATIO STRUCTURES

HEXSIL

LIGA

Compatibility and Manufacturing Constraints of LIGA

MATERIALS AND PROCESSES FOR ENHANCED-FORCE MICROACTUATION

Materials

Magnetic Thin-Films

Piezoelectric Films

Shape-Memory Alloys

Shape-Memory Polymers

Magnetostrictive Alloys

Processing

Processing Multilayer Ceramics

Thin-Film Processing.

FILMS FOR USE IN SEVERE ENVIRONMENTS: SILICON CARBIDE AND DIAMOND

Silicon Carbide

Diamond

SURFACE MODIFICATIONS/COATINGS

Plasma-Deposited Polymers

Polyimides

Conducting Polymers

POWER SUPPLIES

4 Designing Microelectromechanical Systems

METROLOGY

MODELING

COMPUTER-AIDED DESIGN SYSTEMS

FOUNDRY INFRASTRUCTURE

5 Assembly, Packaging, and Testing

CONTRASTS BETWEEN ASSEMBLY, PACKAGING, AND TESTING OF INTEGRATED CIRCUITS AND MICROELECTROMECHANICAL...

INTERFACES

Biomedical Interfaces

Optical Interfaces

Electrical Power

Fluidics

Mechanical Interfaces

PACKAGING

Handling Issues

Dicing

Cleanliness

Stiction

Packaging Materials

Stresses on Packaging

Fluid Environment

Vacuum Packaging

ASSEMBLY

Hybrid Assembly

Assembly of Micromechanical Parts

STANDARDS, TESTING, AND RELIABILITY

FAILURE ANALYSIS

References

APPENDICES

Appendix A World Wide Web Sites on MEMS

Appendix B Biographical Sketches of Committee Members.

Notes:

Bibliographic Level Mode of Issuance: Monograph

Includes bibliographical references (p. 51-55).

ISBN:

9786610187096

9780309174343

0309174341

9781280187094

1280187093

9780309591515

0309591511

9780585002507

0585002509

OCLC:

53011051