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Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Format:
- Book
- Author/Creator:
- National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
- Language:
- English
- Subjects (All):
- Electronic packaging--Materials.
- Electronic packaging.
- Electrical engineering--Materials.
- Electrical engineering.
- Physical Description:
- 1 online resource (153 p.)
- Edition:
- 1st ed.
- Place of Publication:
- Washington, D.C. : National Academy Press ; Alexandria, VA : Available from Defense Technical Information Center, Cameron Station, 1990.
- Language Note:
- English
- Contents:
- Materials for High-Density Electronic Packaging and Interconnection
- Copyright
- Abstract
- Preface
- Acknowledgments
- MEETING 1
- MEETING 2
- MEETING 3
- Contents
- Executive Summary
- Chapter 1 Introduction
- Chapter 2 Microelectronic System Trends and Packaging Needs
- SCALING THEORY
- Lithography
- Scaling of Mosfets
- Scaling of CMOS
- Scaling of Bipolars
- GALLUM ARSENIED TECHNOLOGY
- RENT'S RULE
- CHIP TECHNOLOGIES
- Chip Interface Packaging
- Chip Interconnection Packaging
- SOME PACKAGE DESIGN CONSIDERATIONS
- Single-Chip Modules
- Multichip Modules
- REFERENCES
- Chapter 3 Packaging Strategies and Associated Materials and Process Requirements
- PRESENT PACKAGING APPROACHES
- Single-Chip Modules on Printed Wiring Boards
- Thick-Film Multichip Modules Using Ceramic Dielectrics
- FUTURE PACKAGING STRATEGIES
- Thin-Film Multichip Modules Using Polymeric Dielectrics
- References for Table 3-1:
- Wafer-Scale Integration
- PACKAGING MATERIALS REQUIREMENTS
- SUMMARY OF FUTURE PACKAGING MATERIALS AND PROCESSES NEEDS
- Chapter 4 Materials Issues
- DISSIPATION OF HIGH THERMAL LOADS
- DIELECTRIC PROPERTIES
- INTERCONNECT VOIDING
- THERMAL FATIGUE
- INTERFACIAL PROCESSES
- HIGH-TEMPERATURE STABILITY AND CHEMICAL REACTIONS
- TRACE RADIONUCLIDES IN PACKAGING MATERIALS
- ELECTROMAGNETIC INTERFERENCE
- ENCAPSULANTS AND HERMETICITY
- MATERIALS-RELATED RELIABILITY ISSUES
- MILITARY PACKAGING
- Chapter 5 Some Specific Materials
- THE EVOLUTION OF EPOXY MATERIALS IN PLASTIC PACKAGING
- Epoxy Versus Silicone Materials
- Low-Stress Materials
- Low-Alpha Materials
- Processing Improvements
- Market Shares of the Major Molding Compound Suppliers
- FUTURE TRENDS IN PLASTIC PACKAGING MATERIALS
- Surface-Mount Technology
- Very High Pin Count Packages
- Heat Dissipation.
- Plastic Alternatives to Epoxy Encapsulation
- ORGANIC PRINTED CIRCUIT BOARD MATERIALS
- PROCESSING TECHNOLOGY FOR CERAMIC PACKAGES, BOARDS, AND SUBSTRATES
- Dry Pressing
- The Ceramic Tape Process
- Screen Printing
- OTHER CERAMIC MATERIALS
- Glass and Porcelain
- Low-Fire Materials
- Low-Dielectric-Constant Materials
- High-Thermal-Conductivity Materials
- POLYIMIDES IN HIGH-DENSITY PACKAGING
- Trends in High-Density Packaging
- Polyimide Processing
- Polyimides and Properties for High-Density Interconnection
- Photosensitive Polyimides
- General Availability of Technical Information on Polyimides
- Polymers in Future High-Density Interconnection Technologies
- TAPE AUTOMATED BONDING
- DIAMOND
- SUPERCONDUCTORS
- COMPOSITES
- MATERIALS FOR VERY-HIGH-FREQUENCY DIGITAL SYSTEMS
- MATERIALS FOR CONNECTOR APPLICATIONS
- THE THERMAL CONDUCTION MODULE
- Chapter 6 Organizational, Funding, and Policy Issues
- INTEGRATION
- SYSTEMS VERSUS MATERIALS APPROACHES
- PROGRAMS AND CONSORTIA
- Very-High-Speed Integrated Circuits (VHSIC)
- Microwave and Millimeter-Wave Monolithic Integrated Circuits (MIMIC)
- Semiconductor Research Corporation (SRC)
- Microelectronics and Computer Technology Corporation (MCC)
- SEMATECH
- Other Considerations
- THE UNIVERSITY ROLE
- EMIGRATION OF TECHNOLOGY
- PRIVATE FUNDING AND PUBLIC FUNDING
- CONCLUSION
- Appendix A Glossary of Some Terms and Acronyms Used in This Report
- Appendix B Some Industry Component Data
- Appendix C Microprocessor Operating and Structural Parameters
- Appendix D Examples of Developments in Board Technologies
- Appendix E Materials Properties
- Appendix F Examples of Multichip Modules
- Appendix G Biographical Sketches of Committee Members.
- Notes:
- "NMAB-449."
- Includes bibliographical references.
- ISBN:
- 9786610212514
- 9781280212512
- 1280212519
- 9780309536691
- 0309536693
- 9780585143958
- 0585143951
- OCLC:
- 70773031
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