2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) : proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) : July 15 -16, 2014, the University of Tokyo, YAYOI Auditorium, Tokyo, Japan / editors, Tadatomo Suga, Hideki Takagi, Eiji Higurashi ; sponsor, The IEEE Components, Packaging, and Manufacturing Technology Socitory.

Format:

Book

Conference/Event

Contributor:

Suga, Tadatomo, 1953- editor.

Takagi, Hideki, 1922- editor.

Higurashi, Eiji, editor.

IEEE Xplore (Online service)

Components, Packaging & Manufacturing Technology Society, sponsoring body.

Institute of Electrical and Electronics Engineers, publisher.

Conference Name:

IEEE International Workshop on Low Temperature Bonding for 3D Integration (4th : 2014 : Tokyo, Japan)

Language:

English

Subjects (All):

Sealing (Technology)--Congresses.

Sealing (Technology).

Three-dimensional integrated circuits--Congresses.

Three-dimensional integrated circuits.

Photonics--Materials--Congresses.

Photonics.

Photonics--Materials.

Genre:

Conference papers and proceedings.

Physical Description:

1 online resource (various pagings) : illustrations

Other Title:

Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Also known as: LTB-3D 2014

Available from some providers with title: Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on

Place of Publication:

Piscataway, NJ : IEEE, [2014?]

System Details:

text file

Notes:

"IEEE Part Number: CFP1418S-ART"

Includes bibliographical references.

Description based on online resource; title from PDF title page (IEEE Xplore, viewed July 10, 2015).

OCLC:

893191815

Access Restriction:

Restricted for use by site license.