2 options
2014 International Conference on Electronics Packaging (ICEP) : Toyama International Convention Center, Toyama, Japan, April 23 (Wed.)-25 (Fri.) / sponsored by JIEP (the Japan Institute of Electronics Packaging), IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society Japan Chapter, iMAPS (International Microelectronics And Packaging Society ; edited and assembledby the Technical Program Committe.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Conference on Electronics Packaging (2014 : Toyama-shi, Japan)
- International Conference on Electronics Packaging. Technical Program Committee, editor of compilation.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (various pagings) : illustrations
- Other Title:
- ICEP 2014
- Available from some providers with title: Electronics Packaging (ICEP), 2014 International Conference on
- Place of Publication:
- Tokyo, Japan : Japan Institute of Electronics Packaging, [2014?]
- System Details:
- text file
- Notes:
- "Part Number: CFP1489U-CDR"--PDF copyright page.
- Includes bibliographical references.
- Description based on online resource; title from PDF cover page (IEEE Xplore, viewed May 14, 2015).
- OCLC:
- 883575736
- Access Restriction:
- Restricted for use by site license.
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.