2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) : SISPAD 2013 : 3rd-5th September 2013, Grand Central Hotel, Glasgow, Scotland / technical co-sponsors: IEEE, IEEE Electron Devices Society, IEEE-EDS Scotland Chapter.

Format:

Book

Conference/Event

Contributor:

IEEE Xplore (Online service)

Institute of Electrical and Electronics Engineers, publisher, sponsoring body.

IEEE Electron Devices Society, sponsoring body.

IEEE Electron Devices Society. Scotland Chapter, sponsoring body.

Conference Name:

International Conference on Simulation of Semiconductor Processes and Devices (2013 : Glasgow, Scotland)

Language:

English

Subjects (All):

Semiconductors--Mathematical models--Congresses.

Semiconductors.

Semiconductors--Mathematical models.

Semiconductors--Design and construction--Congresses.

Semiconductors--Design and construction.

Semiconductors--Simulation methods--Congresses.

Computer-aided design--Congresses.

Computer-aided design.

Semiconductors--Simulation methods.

Genre:

Conference papers and proceedings.

Physical Description:

1 online resource : illustrations

Other Title:

SISPAD 2013

18th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Available from some providers with title: Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on

Place of Publication:

Piscataway, NJ : IEEE, c2013.

System Details:

text file

Notes:

IEEE Catalog Number: CFP13SSD-ART.

Includes bibliographical references and author index.

Description based on online resource; title from PDF title page (IEEE Xplore, viewed July 23, 2014).

OCLC:

868204263

Access Restriction:

Restricted for use by site license.